yoctozant

CAD- Si Pkg Board

CAD- Si Pkg Board

CAD- Si Pkg Board

CAD – Si, Package & Board involves developing and maintaining design tools, automation flows, and methodologies that support the complete path from silicon layout to package and PCB integration. At Yoctozant, we enable seamless interoperability between IC design, packaging, and board-level systems by building robust CAD frameworks, creating PDKs, managing EDA environments, and automating multi-domain workflows. Our CAD solutions ensure accuracy, consistency, and efficiency across the entire design ecosystem—accelerating development and improving product reliability.

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Methodology Development

We define robust, scalable methodologies for Si, Package, and Board co-design flows, covering layout planning, DRC rule integration, stack-up design, routing strategy, and multi-die interface mapping. Our approach ensures high design reliability with minimal iteration cycles.

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Automation

We develop automation scripts and CAD frameworks for placement, routing, constraint validation, SI/PI analysis setups, BOM generation, documentation, and release workflows—reducing manual work and enhancing throughput.

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QA and Validation

Our engineers conduct thorough validation checks, including spacing rules, thermal limits, high-speed routing constraints, impedance continuity, crosstalk risk, PDN stability, and manufacturability compliance. We help detect issues early, ensuring a robust final package and board layout.

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Release & Support

We provide end-to-end release management, database version control, ECO handling, supply chain readiness, and continuous engineering support. Our release cycles focus on stability, reliability, and smooth handoff to fabrication and assembly partners.

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